SPECIFICATIONS: Color: Gold Thermal Conductivity: 2.0 W/M-K Thermal Impedance: 0.136 ºC-in²/W Specific Density: 2.4 G/Cc at 25ºC Evaporation Rate: 0.005% at 150ºC/24 hours Dielectric Constant: 5/100Hz Working Temperature: -50 to 200ºC COMPOSITION: Metal Oxides: 50% Silicone (PDMS): 40% Carbon Composite: 10% Technical Features: Application: CPUs and components in general Color: Gold Composition: Silicone (PDMS), metal particles, carbon composite Note: Insoluble in water Product: Thermal Bonding Paste Size: 3g Working Temperature: max. -50ºC... +200ºC
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