Application: CPUs and components in general Color: Gray Composition: Silicone (PDMS), metal particles, carbon composite Note: Insoluble in water Product: Thermal bonding paste Size: 7g Working temperature: Max. -50°C... +200°C
High-performance thermal compound with metal and carbon microparticles. This compound does not dry, harden, or melt, and can withstand temperatures up to 200°C for extended periods. SPECIFICATIONS: Color: Gray Thermal Conductivity: 4.8 W/M-K Thermal Impedance: 0.108 ºC-in2/W Specific Density: 2.3 G/cc at 25°C Evaporation: 0.005% at 150°C/24 hours Dielectric Constant: 5/100Hz Working Temperature: -50 to 200°C COMPOSITION: Metal Oxides: 50% Silicone (PDMS): 40% Carbon Composite: 10% Technical Features Application: CPUs and components in general Color: Gray Composition: Silicone (PDMS), metal particles, carbon composite Note: Insoluble in water Product: Thermal Bonding Paste Size: 7g Working Temperature: Max. -50°C... +200°C